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Destructive Physical Analysis (DPA)

In manufacturing every step or process that a device or product goes through increases the value and function of the device, but also has the potential to introduce issues from improper assembly, inadequate or contaminated materials, or processing. With the increasing number of contract manufacturing arrangements, foreign outsourcing of parts, and shrinking tolerances in the final products, the number of ways in which a small variation in assembling methodology or quality can impact the final part has increased significantly.

In an ideal world, real time monitoring during manufacture should be able to limit issues but it’s often extremely fine details that lie on the interior of the finished product that can make the largest impact on the final results. There are a number of features that can only be revealed by disassembling or dissecting the final product. Likely the most common technique is cross sectional analysis which employs a hard epoxy support structure to maintain sample integrity though cutting, grinding and polishing to a feature or area for examination allowing for microscopic analysis of the interaction between different components in the sample. In the case of even more sensitive or smaller samples, FIB sections can be prepared, allowing examination of sections on the order of several microns to be prepared, or – for the ultimate resolution, thin sections can be prepared for TEM analysis on the order of a single nm or smaller or for performing microstructural analytical techniques such as EBSD. Other common techniques include Decapsulation of IC's, Dye & Pry of BGA's, Bond Pull, Ball Shear, and numerous other methods. 
fib section IC dnp step window ic bga
Advanced MicroAnalytical can provide DPA services in accordance with Mil-STD 883, Mil-STD 1580, Mil-STD 750, Mil-STD 202 as well as customized methods and testing to fit the requirements of your project. Advanced MicroAnalytical understands the process and workflow associated with both non-destructive and destructive physical analysis. Our experienced staff can work with you to step through stages of analysis, performing non-destructive and iterative destructive analysis on samples so that you can find any problems that might be lurking below the surface. 

Here at Advanced MicroAnalytical, we offer Mil STD 1580 Destructive Physical Analysis, (DPA) for the majority of all common electronics part types.  Here is a complete list of requirements for each type of part covering everything from attenuators to transistors.  If you have a part type that isn't listed let us know and we're happy to assemble the requisite analysis and pricing for you.  Pricing is avaiable for all of these options.  Simply click on the Contact Us button in the upper right corner of the the home page or right HERE!
Attenuators DPA Mil STD 1580 Capacitors DPA Mil STD 1580
Connectors DPA Mil STD 1580 Crystals DPA Mil STD 1580
Diodes DPA Mil STD 1580 EMI Filters DPA Mil STD 1580
Fuses DPA Mil STD 1580 Heaters DPA Mil STD 1580
Inductors-Transformers DPA Mil STD 1580 Microcircuits-Hybrids DPA Mil STD 1580
Relays DPA Mil STD 1580 Resistors DPA Mil STD 1580
Saw Devices DPA Mil STD 1580 Switches DPA Mil STD 1580
Thermistors DPA Mil STD 1580 Transistors DPA Mil STD 1580


Related Techniques
EDS/Elemental Mapping
Hardness/Micro-hardness Testing
X-ray Imaging/3D X-Ray CT

Related Industries
Aerospace & Defense
Electronics & Semiconductor
Manufacturing Support
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