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Electronic Components & Semiconductor Analysis

Advanced MicroAnalytical provides manufacturing support and product development assistance for the electronics and semiconductor industry. With the increasing complexity, shrinking node sizes, and proliferation of widely separated micro-electronics assembly partners – products can be more difficult to design, manufacture, and troubleshoot. Advanced MicroAnalytical is your resource for product development support with tools like FIB FESEM and nondestructive testing techniques like, X-Ray, 3D X-Ray CT, and C-SAM.  Advanced MicroAnalytical is positioned to assist with your project from all phases of the electronics industry pipeline – from fab-less design engineering groups through photo or e-beam lithography process troubleshooting or board level component assembly and mass manufacturing. 

  • Integrated Circuits
  • Dielectrics
  • Printed Circuit Board Assemblies (PCBA)
  • MEMS Devices
  • Electronic Components
  • Packaging Materials
  • Molded Parts
  • Cables & Connectors

Related Techniques
EDS/Elemental Mapping
Optical Microscopy
XPS - X-ray Photoelectron Spectroscopy
X-ray Imaging/3D X-Ray CT

Related Lab Services
Destructive Physical Analysis (DPA)
Engineering Support
Failure Analysis
Inspection Services
Integrated Circuit Support
Materials Characterization
Non-Destructive Testing
Product Development R&D
Unknown Material Identification
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