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Electronic Components & Semiconductor Analysis

Advanced MicroAnalytical provides manufacturing support and product development assistance for the electronics and semiconductor industry. With the increasing complexity, shrinking node sizes, and proliferation of widely separated micro-electronics assembly partners – products can be more difficult to design, manufacture, and troubleshoot. For electronics component tests and analysis Advanced MicroAnalytical is your resource for product development support and electonic component testing with tools like FIB FESEM and nondestructive electronic component testing techniques like, X-Ray, 3D X-Ray CT, and C-SAM including faliure analysis of semiconductor devices.  Advanced MicroAnalytical is positioned to assist with your project from all phases of the electronics industry pipeline – from fab-less design engineering groups supported with semiconductor package failure analysis through photo or e-beam lithography process troubleshooting or board level component assembly and mass manufacturing. 

  • Integrated Circuits
  • Dielectrics
  • Printed Circuit Board Assemblies (PCBA)
  • MEMS Devices
  • Electronic Components
  • Packaging Materials
  • Molded Parts
  • Cables & Connectors

Related Techniques
EDS/Elemental Mapping
Optical Microscopy
XPS - X-ray Photoelectron Spectroscopy
X-ray Imaging/3D X-Ray CT

Related Lab Services
Destructive Physical Analysis (DPA)
Engineering Support
Failure Analysis
Inspection Services
Integrated Circuit Support
Materials Characterization
Non-Destructive Testing
Product Development R&D
Unknown Material Identification
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