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Electronics & Semiconductor Testing Laboratory

Advanced MicroAnalytical provides manufacturing support and product development assistance for the electronics and semiconductor industry. With the increasing complexity, shrinking node sizes, and proliferation of widely separated micro-electronics assembly partners – products can be more difficult to design, manufacture, and troubleshoot. Advanced MicroAnalytical is your resource for product development support with tools like FIB FESEM and nondestructive testing techniques like, X-Ray, 3D X-Ray CT, and C-SAM.  Advanced MicroAnalytical is positioned to assist with your project from all phases of the electronics industry pipeline – from fab-less design engineering groups through photo or e-beam lithography process troubleshooting or board level component assembly and mass manufacturing. 

  • Integrated Circuits
  • Dielectrics
  • Printed Circuit Board Assemblies (PCBA)
  • MEMS Devices
  • Electronic Components
  • Packaging Materials
  • Molded Parts
  • Cables & Connectors

Related Techniques
EDS/Elemental Mapping
Optical Microscopy
XPS - X-ray Photoelectron Spectroscopy
X-ray Imaging/3D X-Ray CT

Related Lab Services
DPA (Destructive Physical Analysis)
Engineering Support
Failure Analysis
Inspection Services
Integrated Circuit Support
Materials Characterization
Non-Destructive Testing
Product Development R&D
Unknown Material Identification
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